晶圆传输和检测设备

设备软件系统
Equipment Control System

软件驱动的多尺寸 (multi wafer size) 多载体类型 (multi carrier type) 的自动定义转换、模块化软件平具灵活性和可扩展性、可视化动画界面为用户提供直观的操作体验

我们的设备产品线包括晶圆分选机Sorter /EFEM、OM Loader和视觉检测系统; 使用自主国产机器人及周边组件，我们设备可以处理特殊晶圆，例如 Taiko 、厚、翘曲、透明、穿孔、脆弱晶圆，最适复合晶圆 (碳化硅、砷化鎵) 、IGBT, MEMS等晶圆

Compound wafer
Wafer thickness: 300~1500µm
Edge grip handling & aligning
Electric activated, no vacuum/air
Manual size change

Glass wafer
Wafer thickness: ~500µm
Edge grip handling & aligning
Electric activated, no vacuum/air

Taiko/thin/thick/perforated wafer
Wafer thickness: 100~1500µm
Edge grip handling & aligning (Vortex/Bernoulli aided, flipping)
Top pick/place wafer

Silicon wafer
Wafer thickness: 300~1500µm
Vacuum grip handling & aligning
Software driven size change

Glass wafer
Wafer thickness: 300~1500µm
Edge grip handling & aligning
Top pick/place wafer
Manual size change over

Silicon wafer
Wafer thickness: 300~1500µm
Vacuum grip handling & aligning
Software driven size change over
Optional macro/micro inspection